Revolutionary ultrasonic 'sonar-on-a-chip' MEMS sensors for 3D sensing applications
Chirp Microsystems
Berkeley, CA
Founded Early 2013
Early Stage Revenue
50 Employees
Deal Value
Undisclosed
Outcome
Success
Result
Global Integration
The Challenge
Despite breakthrough miniaturized sonar technology, the startup needed global distribution channels and manufacturing scale to commercialize their innovations in consumer electronics and IoT markets.
“We developed revolutionary miniaturized sonar technology that could transform 3D sensing, but needed a global partner to bring it to market at scale.”
What Happened
Chirp Microsystems pioneered ultrasonic time-of-flight sensors that squeezed sonar capabilities into tiny chips. Their breakthrough technology complemented TDK InvenSense's existing MEMS sensor portfolio perfectly. TDK's acquisition gave Chirp access to global sales channels while filling a critical gap in TDK's 3D sensing offerings. The founding team joined TDK, and the technology was successfully integrated into TDK's CH101/CH201 sensor product lines, reaching worldwide markets.
